IBM and SCREEN Semiconductor Solutions Partner to Enhance Chip Manufacturing Precision

IBM and SCREEN Semiconductor Solutions have forged a strategic partnership to refine the cleaning process in semiconductor manufacturing. The collaboration targets the elimination of microscopic contaminants that compromise chip integrity, particularly in next-generation High NA EUV lithography systems. Dust particles as small as 20 nanometers—roughly 1/5000th the width of a human hair—can RENDER advanced chips unusable.

The alliance combines IBM's semiconductor expertise with SCREEN's wafer-cleaning technology at a critical juncture for the industry. As AI applications demand increasingly powerful chips, manufacturers face mounting pressure to improve yield rates. EUV lithography machines costing over $150 million require pristine conditions to achieve optimal performance.

This technical partnership signals broader industry trends toward collaborative innovation. Semiconductor leaders are pooling resources to overcome physical limitations in chip scaling, with cleaning processes emerging as a key battleground for maintaining Moore's Law momentum.